Nexperia MLPAK33 MOSFETs

MLPAK33 MOSFETs for mobile, computing, consumer and industrial applications, available in N-Channel and P-Channel. The package comes with a large heat sink area for high thermal power capability, housed in the 3.3 x 3.3 mm footprint (0.8 mm height). Offering footprint compatibility for the industry-known DFN3333. MLPAK33 brings low spiking, low ringing, low QG, low QGD and low RDS(on) for benefits in load switching applications such as smartphones.

Key features

• Large heat sink for high thermal power capability 
• Small 3.3 x 3.3 mm footprint
• Low height of only 0.8 mm
• Optimized for a consumer grade application profile
• Low spiking and ringing for low EMI designs
• Voltage range V_DS 25-30V
• Low Q_G & Q_GD for super-fast switching
• Low R_DS(on) down to 6 mΩ and ID up to 13 A
• Logic-level compatible drive voltage
• Power dissipation (P_tot) of up to 4.8 W

Applications

• Low R_DS(on) load switching for e.g. smartphones
• DC/DC conversion
• Battery management
• Charging devices
• Solid state / hard drive

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